Multiobjective optimization of flat plate heat sink geometry using taguchi based grey relational analysis

Abstract

The ever increasing circuit density of Integrated Circuits ICs newlinewith higher clock frequency generates heat in the electronics system chip newlineThe lifetime of electronic components are shortened by the extended use of newlinethem at higher temperatures hence the reliability of the electronic packages newlineare reduced By creating a suitable path to transfer the generated heat to newlineambient the system will be saved from failures like catastrophic thermal newlinefailures which is also called as the total loss of electronic function of a newlinespecific component To improve the amount of heat transfer to the ambient newlinegenerally the chips are mounted on the flat plate heat sinks These heat sinks newlinetransfers the generated heat into the ambient newline newline