Mass Transport in Cu Interlayer Si Systems under Various Thermo Electro Mechanical Excursions

dc.contributor.guide	Kumar, Praveen
dc.coverage.spatial
dc.creator.researcher	Somaiah, Nalla
dc.date.accessioned	2023-03-10T10:32:50Z
dc.date.available	2023-03-10T10:32:50Z
dc.date.awarded	2019
dc.date.completed	2018
dc.date.registered
dc.description.abstract	Available
dc.description.note
dc.format.accompanyingmaterial	None
dc.format.dimensions
dc.format.extent
dc.identifier.uri	http://hdl.handle.net/10603/467790
dc.language	English
dc.publisher.institution	Materials Engineering
dc.publisher.place	Bangalore
dc.publisher.university	Indian Institute of Science Bangalore
dc.relation
dc.rights	university
dc.source.university	University
dc.subject.keyword	Engineering and Technology
dc.subject.keyword	Material Science
dc.subject.keyword	Materials Science Multidisciplinary
dc.title	Mass Transport in Cu Interlayer Si Systems under Various Thermo Electro Mechanical Excursions
dc.title.alternative
dc.type.degree	Ph.D.