Digital 3D Printed Electronics Technology for Electronics Packaging Applications

dc.contributor.guide	Goel, Sanket
dc.coverage.spatial
dc.creator.researcher	Rao, C. Hanumanth
dc.date.accessioned	2023-03-31T05:03:09Z
dc.date.available	2023-03-31T05:03:09Z
dc.date.awarded	2022
dc.date.completed	2022
dc.date.registered	2017
dc.description.abstract	newline
dc.description.note
dc.format.accompanyingmaterial	DVD
dc.format.dimensions
dc.format.extent
dc.identifier.uri	http://hdl.handle.net/10603/473638
dc.language	English
dc.publisher.institution	Electrical and Electronics Engineering
dc.publisher.place	Pilani
dc.publisher.university	Birla Institute of Technology and Science
dc.relation
dc.rights	university
dc.source.university	University
dc.subject.keyword	Engineering
dc.subject.keyword	Engineering and Technology
dc.subject.keyword	Engineering Electrical and Electronic
dc.title	Digital 3D Printed Electronics Technology for Electronics Packaging Applications
dc.title.alternative
dc.type.degree	Ph.D.