Heat transfer enhancement studies on a heat sink using nano coatings and grit blasting methods

Abstract

The tremendous growth in electronic equipments demands innovative newlinesolutions to the thermal management challenges. Nearly 80-90% of input newlinegiven to the electronic devices is converted into heat and hence thermal newlinemanagement is becoming increasingly critical to the electronics industries. newlineMaintaining the junction temperature at an acceptable level is a great newlinechallenge to the thermal engineers. In the present high powered electronic newlinedevices, air-cooled heat sinks are were short falling in attaining the cooling newlinedemands. Hence, in the recent years, numerous techniques for cooling such newlineelectronic devices have been studied broadly and employed in several thermal newlinemanagement systems. The present survey attempts to study the technological newlineimportance and recent developments in cooling systems for electronic devices newlinefor enhancement of its performance by increasing surface roughness through newlinesurface modification techniques. Most of the earlier studies on heat sinks with pin-fins have newlineconsidered the individual geometry compared with other types of fin geometry, materials and fin arrangement. They did not include any surfacemodification for the whole heat sink in their study. The recent pioneeringadvancement in nano technology paves the way to further enhance the heat newlinetransfer in pin-fin heat sinks, through various types of nano-coatings. Though newlinethere are research studies on the use of a grit blasted surface to enhance the newlineheat transfer in selective applications in the recent years, the concept was not newlineattempted for heat sinks to enhance the heat transfer. newline newline