Electric Field Assisted Self Healing Technique eFASH

Abstract

Circuit failure due to the open faults in the interconnect is the most com- newlinemon problem regarding the reliability of electronic systems. This is particularly newlinetrue for large-area electronic systems such as display, image sensor arrays, as newlinewell flexible and wearable electronic systems. To address this problem, various newlinetechniques to repair fractured interconnect in real-time have been investigated. newlineOne approach that is of interest to this work is the electric field-assisted self- newlinehealing (eFASH). The eFASH technique involves the use of a low concentration newlinedispersion of conductive particles in an insulating fluid that is encapsulated newlineover interconnect. When a current-carrying interconnect is fractured an electric newlinefield appears across the open fault. This field polarizes the conductive particles, newlinesubsequently chains them up to create a heal. This work discusses the mecha- newlinenism of self-healing and studies the impact of the dispersion concentration on newlinethe healing time, heal impedance and cross-talk. Theoretical predictions have newlinebeen substantiated by experimental evidence and an optimum dispersion con- newlinecentration for effective self-healing is identified. The application of eFASH for newlinestretchable electronics also has been studied and stretchable heals having a con- newlineductivity about 5×105 S/m and allowing strains from 12 to 60 during stretching newlinehave been demonstrated. newline