Development of a Cu SAC305 based lead free solder joint interface with improved reliability and environmental stability

dc.contributor.guide	Amit K Chakraborty and Abhijit Kar
dc.coverage.spatial
dc.creator.researcher	Monalisa Char
dc.date.accessioned	2023-11-08T08:56:18Z
dc.date.available	2023-11-08T08:56:18Z
dc.date.awarded	2022
dc.date.completed	2022
dc.date.registered
dc.description.abstract	newline
dc.description.note
dc.format.accompanyingmaterial	DVD
dc.format.dimensions
dc.format.extent
dc.identifier.uri	http://hdl.handle.net/10603/524209
dc.language	English
dc.publisher.institution	Physics
dc.publisher.place	Durgapur
dc.publisher.university	National Institute of Technology Durgapur
dc.relation
dc.rights	university
dc.source.university	University
dc.subject.keyword	Physical Sciences
dc.subject.keyword	Physics
dc.subject.keyword	Physics Particles and Fields
dc.title	Development of a Cu SAC305 based lead free solder joint interface with improved reliability and environmental stability
dc.title.alternative
dc.type.degree	Ph.D.