Modeling and Performance Analysis of Cu and Cnt Based Tapered Via Bump Structure

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dc.contributor.guideMajumder, MK and Gupta, D
dc.coverage.spatial
dc.creator.researcherChandrakar, shivangi
dc.date.accessioned2025-07-11T09:33:40Z
dc.date.available2025-07-11T09:33:40Z
dc.date.awarded2025
dc.date.completed2025
dc.date.registered2021
dc.description.note
dc.format.accompanyingmaterialNone
dc.format.dimensions
dc.format.extent235
dc.identifier.researcherid
dc.identifier.urihttp://hdl.handle.net/10603/651504
dc.languageEnglish
dc.publisher.institutionElectronics and Communication Engineering
dc.publisher.placeRaipur
dc.publisher.universityDr. Shyama Prasad Mukherjee International Institute of Information Technology Naya Raipur
dc.relation
dc.rightsuniversity
dc.source.universityUniversity
dc.subject.keywordEngineering
dc.subject.keywordEngineering and Technology
dc.subject.keywordEngineering Electrical and Electronic
dc.titleModeling and Performance Analysis of Cu and Cnt Based Tapered Via Bump Structure
dc.title.alternative
dc.type.degreePh.D.

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