Design and Performance Estimation of Modified Microchannel Heat Sink for Electronic Cooling

Abstract

In electronic devices and components, the thermal management system is essential for providing sufficient cooling to protect the device from failure. Advances in electronic devices cause the demand to dissipate high value heat from the smaller surface area due to its miniaturization and high performance. The microchannel heat sink (MCHS) with liquid as coolant proved to be an efficient method to remove the heat from miniaturized electronic devices due to its high effectual heat dissipating ability, compact size, low weight, etc. Nevertheless, MCHS has also some limitations in practical applications, as it induces high-pressure drop and uneven heat dissipation. Some major attempts were required to overcome those shortcomings and to compensate for the future heat dissipation demand. Efforts have been made to improve the performance of MCHS in the present research work using various techniques newline